智慧型精微製造之系統整合及技術布局發展策略


  • 書  號: MIRDC-102-S402
  • 作  者: 陳仲宜
  • 出  版: 2014-01-01
  • 本書定價: NT$ 3,000

在輕薄短小及多功能需求等訴求已成為主流的趨勢演變下,產品高值化時,精微零組件扮演高品質及造成難以仿製的重要角色。無論從全球的角度來看,或者是為了因應台灣的未來產業發展需求,精微製造技術之關連市場均符合市場潛力大、應用產業多樣化、附加價值高、技術層次高、具環境友善性及能源依存度低等六大原則,是一個非常值得投入發展的新興策略性工業市場。 第一章 緒論 1 第二章 精微製造系統發展綜述 7 第三章 精微製造關聯市場分析 49 第四章 系統整合技術佈局分析 89 第五章 發展機會與策略分析 137 第六章 結論與建議 145 參考資料 155 附錄 157

目錄索引


第一章 緒論 ········································································· 1
第一節 研究動機與目的 ····························································· 1
第二節 研究範圍與架構 ····························································· 3
第三節 研究方法與流程 ····························································· 4
第四節 研究時程與限制 ····························································· 5
第二章 精微製造系統發展綜述 ·················································· 7
第一節 智慧型精微製造系統之定義與分類 ······································· 7
第二節 精微加工系統 ······························································ 10
第三節 精微成形系統 ······························································ 22
第四節 精微處理系統 ······························································ 28
第五節 精微結合系統 ······························································ 32
第六節 精微組裝系統 ······························································ 39
第三章 精微製造關聯市場分析 ················································· 49
第一節 精微產品整體市場規模分析 ············································· 49
第二節 智慧行動裝置應用市場 ··················································· 52
第三節 穿戴式電子應用市場 ····················································· 58
第四節 高速傳輸應用市場 ························································ 74
第五節 微創醫材應用市場 ························································ 83
第四章 製造系統整合技術佈局分析 ············································ 89
第一節 發展緣由 ··································································· 89
第二節 智慧型精微製造整合系統發展概說 ····································· 91
第三節 複合加工技術 ······························································ 95
第四節 精密定位技術 ····························································· 106
第五節 可重組技術 ································································ 109
第六節 影像量測技術 ····························································· 122
第七節 狀態監控技術 ····························································· 125
第八節 系統整合技術發展藍圖 ·················································· 134
第五章 發展機會與策略分析 ·················································· 137
第一節 產業發展前景分析 ······················································· 137
第二節 產業價值鏈分析 ·························································· 139
第三節 產業鏈缺口分析 ·························································· 139
第四節 SWOT 分析 ································································ 141
第五節 關鍵成功因素 ····························································· 143
第六章 結論與建議 ······························································ 145
第一節 結論 ········································································ 145
第二節 建議 ········································································ 148
參考資料 ············································································ 155
附錄 ·················································································· 157

回列表
TOP